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electronic packaging
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integrated circuits
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junctions
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semiconductors
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thermal properties
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Date
2001
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School
OGI School of Science and Engineering
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Department
Dept. of Materials Science and Engineering
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Resource type
dissertation
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Creator
Geoffrey J. M. Peter
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Ph.D.
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Scholars Archive
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Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects
Creator:
Geoffrey J. M. Peter
Date:
2001
Document Type:
dissertation